Heat radiation package and semiconductor device

摘要

A heat radiation package of the present invention includes a substrate (10) in an upper surface side of which recess portion (C) is provided, embedded wiring portion (14) which is filled in the recess portion (C) of the substrate (10) and on which semiconductor element (20, 22) which generates a heat is mounted, and a heat sink (30) connected to a lower surface side of the substrate (10). The substrate (10) is made of silicon, ceramics, or insulating resin.