| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer for which erroneous fault dotting is not performed by having a characteristic checking device and a marking device recognize the same element as a reference element regardless of the arrangement of an element pattern inside the wafer and even in the case that an element size is reduced, and its manufacturing method. SOLUTION: In the semiconductor wafer 2 which is reduced, projected and exposed for two or more times by using a reticle where the plurality of element patterns are formed, a non-exposure part 1 where the element pattern is not exposed in one or more of the plurality of exposure processes is provided. COPYRIGHT: (C)2006,JPO&NCIPI |
