SEMICONDUCTOR PACKAGE AND THE METHOD FOR FABRICATING THEREOF

摘要

PURPOSE: A semiconductor package and a method for fabricating thereof are provided to improve the reliability of a semiconductor package by designing heat radiation member through which heat is discharged from the semiconductor package in high speed operation. CONSTITUTION: At least one of semiconductor chips(150a, 150b, 150c, 150d) is staked on a substrate. A connection member electrically connects the substrate to the stacked semiconductor chips. A sealing unit(190) includes the stacked semiconductor chip and the connecting member and seals up one side of the substrate. A plurality of heat radiation members(160) are formed in the sealing unit of the stacked semiconductor chips.