In the case where a chip is made of wide band gap semiconductor, a power conversion apparatus is obtained in which a package (41) in which the chip made of the wide band gap semiconductor is sealed, and a printed circuit board (43) on which a pattern connected to a terminal (42) of the package (41) is formed. The package (41) is thermally insulated from the printed circuit board (43) and a component on the printed circuit board (43) so that temperatures of the printed circuit board (43) and the component thereon are equal to or lower than respective heat resistant temperatures thereof even when a temperature of the chip exceeds the heat resistant temperature of at least one of the printed circuit board (43) and the component on the printed circuit board (43).
