发明名称
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for easily manufacturing a high quality non-contact power supply module. <P>SOLUTION: This method for manufacturing a non-contact power supply module comprises a sheet sandwiching process for sandwiching the both sides of a substrate 52 on which a coil 1 and a core 55, a circuit 58 and a lead wire 54 are mounted by a pair of cover sheets 51 formed so as to be made long outward from a substrate 52 at the deriving side of a lead wire 54; a resin packing process for packing resin 70 between the pair of cover sheets 51 from the deriving side of the lead wire 54, and for sealing the coil 1, the core 55, and the circuit 58; and a sheet cutting process for cutting the section formed so as to be made long outward from the substrate 52 of the pair of cover sheets 51. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP4584763(B2) 申请公布日期 2010.11.24
申请号 JP20050126712 申请日期 2005.04.25
申请人 发明人
分类号 H01F38/14;H02J17/00;H02M7/48 主分类号 H01F38/14
代理机构 代理人
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