发明名称 APPARATUS FOR LOADING SUBSTRATE
摘要 <p>PURPOSE: A substrate loading device is provided to reduce a manufacturing process and manufacturing time by automating a process of fixing a substrate and a carrier, which are applied to a memory card, without using a heat-resistance tape. CONSTITUTION: A substrate alignment part(100) aligns a substrate by transferring the substrate in a first direction. A carrier boat transferring part(200) is arranged to be contiguous to the substrate alignment part. The carrier boat transferring part transfers a carrier boat for loading at least two substrates in the first direction. A pick up part(300) offers the substrate from the substrate alignment part to the carrier boat. A carrier cover covers the edge of the substrate arranged in the carrier boat transferring part. The carrier cover has an opening exposing the central part of the substrate.</p>
申请公布号 KR20100123411(A) 申请公布日期 2010.11.24
申请号 KR20090042623 申请日期 2009.05.15
申请人 HYNIX SEMICONDUCTOR INC. 发明人 LEE, EUN SIK;KOH, KWANG DUCK;LEE, JUM DONG;LEE, HWA SEOB;SHIN, JAE MOO
分类号 H05K13/02;B65G49/07;H01L21/677 主分类号 H05K13/02
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