发明名称 SOLAR SEMICONDUCTOR PACKAGE
摘要 PURPOSE: A solar semiconductor package is provided to reduce manufacturing costs by simplifying the structure of the device simple. CONSTITUTION: A semiconductor chip for a photovoltaic generation semiconductor chip is mounted in a substrate(12). A housing(14) is an insulating mold having a solar condensing unit which is protruded from the housing while having a certain interval from the top of a semiconductor chip. First and second electrode sections are formed which have different height around the housing. A conductive contact unit(24) is connected to the bonding pad of a semiconductor and first electrode section of the housing.
申请公布号 KR20100123270(A) 申请公布日期 2010.11.24
申请号 KR20090042410 申请日期 2009.05.15
申请人 AMKOR TECHNOLOGY KOREA, INC. 发明人 PARK, SUNG SUN;LEE, DO WON
分类号 H01L23/04;H01L23/48;H01L27/142;H01L31/052 主分类号 H01L23/04
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