发明名称 |
SOLAR SEMICONDUCTOR PACKAGE |
摘要 |
PURPOSE: A solar semiconductor package is provided to reduce manufacturing costs by simplifying the structure of the device simple. CONSTITUTION: A semiconductor chip for a photovoltaic generation semiconductor chip is mounted in a substrate(12). A housing(14) is an insulating mold having a solar condensing unit which is protruded from the housing while having a certain interval from the top of a semiconductor chip. First and second electrode sections are formed which have different height around the housing. A conductive contact unit(24) is connected to the bonding pad of a semiconductor and first electrode section of the housing. |
申请公布号 |
KR20100123270(A) |
申请公布日期 |
2010.11.24 |
申请号 |
KR20090042410 |
申请日期 |
2009.05.15 |
申请人 |
AMKOR TECHNOLOGY KOREA, INC. |
发明人 |
PARK, SUNG SUN;LEE, DO WON |
分类号 |
H01L23/04;H01L23/48;H01L27/142;H01L31/052 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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