发明名称 Circuit board structure having embedded capacitor and fabrication method thereof
摘要 The present invention provides a circuit board structure having an embedded capacitor and a method for fabricating the same. The circuit board structure includes a core layer board with at least one surface having non-penetrating first and second grooves, a circuit layer and a first electrode plate formed in the first and second grooves of the core layer board respectively and being flush with the core layer board; a high dielectric material layer formed on the core layer board, the circuit layer and the first electrode plate; a second electrode plate formed on the high dielectric material layer and corresponding to the first electrode plate, thereby forming a capacitor by the first and second electrode plates and the high dielectric material layer. The high dielectric material layer is formed on a plane surface so as to eliminate poor filling and improve reliability.
申请公布号 US7839650(B2) 申请公布日期 2010.11.23
申请号 US20070977780 申请日期 2007.10.25
申请人 UNIMICRON TECHNOLOGY CORP. 发明人 HSU SHIH-PING
分类号 H05K1/18 主分类号 H05K1/18
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