发明名称 Method for fabricating an electronic device
摘要 The invention provides an article and process for producing electronic devices. More particularly the invention relates to an article and process for fabricating patterns of electrically conductive materials on non-electrically conductive substrates by laser ablation. Such an article and process find use in the production of RDIF devices, antennae, electrical circuits, microwave susceptors, contacts, leads, conductors, interactive displays, electrostatic shielding devices and the like. The process involves first providing an electrically conductive metal layer on an electrically non-conductive substrate. Then an electronic circuit is electrically connected to the electrically conductive metal layer. Thereafter a portion of the electrically conductive metal layer is ablated with infrared laser radiation to form a pattern of electrically conductive areas and electrically non-conductive areas on the substrate, wherein at least a portion of the electrically conductive areas are electrically connected to the electronic circuit.
申请公布号 US7836588(B2) 申请公布日期 2010.11.23
申请号 US20070772413 申请日期 2007.07.02
申请人 IDEON LLC 发明人 LAKSIN MIKHAIL;CHATTERJEE SUBHANKAR
分类号 H05K3/02 主分类号 H05K3/02
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