发明名称 Thin film diode panel and manufacturing method of the same
摘要 A thin film diode array panel comprising: an insulating substrate (110); first and second redundant gate lines (141, 142) made of an opaque conductor and formed on the insulating substrate; first and second floating electrodes (143, 144) made of an opaque conductor, formed on the insulating substrate, and disposed between the first and second redundant gate lines (141, 142); an insulating layer (151, 152) formed on the first and second floating electrodes (143, 144); a first gate line (121) formed on the first redundant gate line (141) and including a first input electrode (123) overlapping the first floating electrode (143) where the insulating layer (151) is interposed between the first input electrode and the first floating electrode; a second gate line (122) formed on the second redundant gate line (142) and including a second input electrode (124) overlapping the second floating electrode (144) where the insulating layer (152) is interposed between the second input electrode (124) and the second floating electrode (144); and a pixel electrode (190) including a first contact electrode (191) overlapping the first floating electrode (143) where the insulating layer (151) is interposed between the first contact electrode (191) and the first floating electrode (143), a second contact electrode (192) overlapping the second floating electrode (144) where the insulating layer (152) is interposed between the second contact electrode (192) and the second floating electrode (144), and a main body is provided.
申请公布号 US7839463(B2) 申请公布日期 2010.11.23
申请号 US20040578028 申请日期 2004.10.28
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SHIN KYOUNG-JU;CHAI CHONG-CHUL;OH JOON-HAK;KIM JIN-HONG;HONG SUNG-JIN
分类号 G02F1/136;G02F1/1343;G02F1/1362;G02F1/1365 主分类号 G02F1/136
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