| 摘要 |
A method for manufacturing a semiconductor physical quantity sensor having a fixed portion, a movable portion and an output terminal includes: forming a metal layer on a semiconductor layer; forming a resist on the metal layer; forming an opening and a side etching hole in the resist; anisotropically etching the metal layer via the opening and the hole; anisotropically etching the semiconductor layer via the opening so that the fixed portion is formed in the semiconductor layer; and side etching the metal layer from the opening and the hole so that the output terminal is formed on a part of the fixed portion, and a metal member is formed on another part of the fixed portion in such a manner that the metal member is electrically separated from the output terminal.
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