| 摘要 |
A method of forming a metal multilayer pattern for hermetic sealing of a package. According to the method, a metal multilayer pattern for hermetic sealing of a package is formed by forming latent image centers for crystal growth using a photocatalytic compound, followed by plating the latent pattern. The method avoids the use of vacuum deposition processes, e.g., sputtering and evaporation, requiring vacuum conditions. In addition, the method does not involve a photolithographic process for the formation of the metal multilayer pattern. Accordingly, the metal multilayer pattern for hermetic sealing of a package can be formed in a simple and economical manner. |
