| 摘要 |
An integrated circuit (IC) includes a package substrate, a die, and an antenna structure. The die includes a functional circuit module and a radio frequency (RF) transceiver that processes inbound and outbound RF signals. The antenna structure is coupled to the RF transceiver and is on the die and/or the package substrate. The antenna structure receives the inbound RF signal within a frequency band of approximately 55 GHz to 64 GHz and transmits the outbound RF signal within the frequency band.
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