| 摘要 |
PURPOSE: A method for measuring the measurement object area projected on a PCB is provided to magnify the area over than the reference height into a solder paste and compares the 2D color information of the solder paste with other region, thereby measuring the solder paste area accurately. CONSTITUTION: A 3D height information of a PCB(Printed Circuit Board) uses an first image which is photographed by examining a grid pattern beam and obtains the height information. As a first area projected above the reference height to the PCB uses the height information, it is checked as measurement object(S110). The color information of the PCB uses an second image by examining the light of a second lighting unit to the PCB to obtain the color information(S130). The first color information of the first area is sets as a reference color information(S140). By comparing the reference color information and color information in an area except a first area, the device determines whether the measurement object is formed or not(S150).
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