PURPOSE: The bump printing device effectively prevents the fault generation of the solder bump and printability and yield are improved and the reliability of substrate is multiplied therefore. CONSTITUTION: A substrate is settled in the printing table(10). The mask(20) adheres closely to the top of the substrate. The solder bump is printed on the top of the substrate while mask separates after printing. In the mask table(30) is the printing table, it is expnded to the end part of mask.
