| 发明名称 |
Heat dissipation device and computer using same |
| 摘要 |
A heat dissipation device includes a fin unit, a heat spreader and a heat isolation layer. The heat spreader contacts the fin unit and transfers heat to the fin unit for dissipation. The heat isolation layer is coated on an outer surface of the heat dissipation device. The heat isolation layer is polyurethane foam.
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| 申请公布号 |
US7839630(B2) |
申请公布日期 |
2010.11.23 |
| 申请号 |
US20090396481 |
申请日期 |
2009.03.03 |
| 申请人 |
FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.;FOXCONN TECHNOLOGY CO., LTD. |
发明人 |
HWANG CHING-BAI;MENG JIN-GONG;LIANG CHENG-JEN |
| 分类号 |
G06F1/20;H05K7/20 |
主分类号 |
G06F1/20 |
| 代理机构 |
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代理人 |
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| 主权项 |
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