发明名称 Method and system for patterning alignment marks on a transparent substrate
摘要 Disclosed is a method and a system for forming alignment marks on a transparent substrate. A light reflective layer is deposited over an optically transparent substrate of a wafer. A region is defined around an alignment mark on the optically transparent substrate. The light reflective layer is removed from a substantial portion of the transparent substrate excluding the region. In addition, a micro electro-mechanical systems device is disclosed. The device comprises an optically transparent substrate, at least one optically partially transparent alignment mark on the optically transparent substrate, and a plurality of reflective elements or imaging pixels attached to the optically transparent substrate.
申请公布号 US7838386(B2) 申请公布日期 2010.11.23
申请号 US20080235960 申请日期 2008.09.23
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 JANG RUEI-HUNG;LEE YA-WEN;WU TZU-YANG;PAN SHENG-LIANG;LIN CHIN-HSIANG;GAU TSAI-SHENG
分类号 H01L21/76;H01L21/00;H01L23/544 主分类号 H01L21/76
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