发明名称 |
Method and system for patterning alignment marks on a transparent substrate |
摘要 |
Disclosed is a method and a system for forming alignment marks on a transparent substrate. A light reflective layer is deposited over an optically transparent substrate of a wafer. A region is defined around an alignment mark on the optically transparent substrate. The light reflective layer is removed from a substantial portion of the transparent substrate excluding the region. In addition, a micro electro-mechanical systems device is disclosed. The device comprises an optically transparent substrate, at least one optically partially transparent alignment mark on the optically transparent substrate, and a plurality of reflective elements or imaging pixels attached to the optically transparent substrate.
|
申请公布号 |
US7838386(B2) |
申请公布日期 |
2010.11.23 |
申请号 |
US20080235960 |
申请日期 |
2008.09.23 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
JANG RUEI-HUNG;LEE YA-WEN;WU TZU-YANG;PAN SHENG-LIANG;LIN CHIN-HSIANG;GAU TSAI-SHENG |
分类号 |
H01L21/76;H01L21/00;H01L23/544 |
主分类号 |
H01L21/76 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|