发明名称 Substrate collection method and substrate treatment apparatus
摘要 When a trouble occurs in a substrate treatment apparatus, the substrate existing in the substrate treatment apparatus is quickly collected without exerting adverse effects on the subsequent substrate treatment to resume the substrate treatment early. At the time of occurrence of trouble in a coating and developing treatment apparatus, all of the substrates in the coating and developing treatment apparatus are collected to a transfer-in/out section using a transfer unit in the apparatus. In this event, each transfer unit transfers the substrate from each position at the time of occurrence of trouble in a direction toward the transfer-in/out section for collection. Further, the substrate under treatment in the treatment unit at the time of occurrence of trouble is collected after the treatment is finished.
申请公布号 US7840299(B2) 申请公布日期 2010.11.23
申请号 US20050571613 申请日期 2005.06.23
申请人 TOKYO ELECTRON LIMITED 发明人 HIGASHI MAKIO;MIYATA AKIRA;HARA YOSHITAKA
分类号 G06F19/00;H01L21/027;H01L21/677 主分类号 G06F19/00
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