发明名称 RIGID-FLEXIBLE STACKMODULE SUBSTRATE AND FABRICATING METHOD THE SAME
摘要 PURPOSE: By using the rigid flexible substrate, the rigid flexible stack module substrate and manufacturing method thereof form the structure in which the first rigid part and the second rigid part are laminated. CONSTITUTION: The flexible substrate divided by the first rigid region and the second rigid region is prepared. The rigid substrate(132) is laminated in the single-side of the flexible substrate. The first outer layer circuit layer(160a) including the second terminal(164) is formed in the other side of the flexible substrate.
申请公布号 KR20100122301(A) 申请公布日期 2010.11.22
申请号 KR20090041277 申请日期 2009.05.12
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD.;SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, YANG JE;KIM, DO HYUNG;CHO, JUNG CHAN;CHOI, HYUN SEOK;JANG, JUNG HOON;SHIN, JAE HO
分类号 H05K3/46;H01L23/14 主分类号 H05K3/46
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