SOLID-STATE IMAGING DEVICE, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE

摘要

PURPOSE: In the solid imaging apparatus, and the manufacturing method of the solid imaging apparatus and electronic device, the photo diode are formed in the surface of the semiconductor substrate. When the light is income in the photo diode, the video signal is obtained with the signal charge generated in the photo diode. CONSTITUTION: The semiconductor substrate is the diode of the plurality of the upper part, first wire portion, and the second wire portion and the third wire portion is included. The first wiring layer is formed on the semiconductor substrate. The first wiring layer includes a plurality of metal layers and it extends through the wire portion whole. The solid imaging apparatus(10) has the sensor unit domain(20) formed in the semiconductor substrate(11) and the peripheral circuit region(30) arranged in around the.