| 摘要 |
<p>FIELD: electricity. ^ SUBSTANCE: in method of gripping of semiconducting plates for loading and unloading, gripping is done in the following manner: vacuum arrives to fluoroplastic tube 3, then it arrives to spatula-like fluoroplastic tip 1, by pressing valve 4, vacuum is sent through holes 2 to plate, vacuum supply is controlled with the help of valve 4, vacuum is sent at the pressure of 0.8 kg/cm2, number of holes on tip is 5, diametre of holes is 3 mm. ^ EFFECT: invention eliminates possibility of metal touching surface of semiconductor plates, provides for reduction of cracks and dents in process of loading and unloading, and provides for full coverage of semiconducting plates and increased percentage of good yield. ^ 1 dwg, 4 ex</p> |
