发明名称 |
DICING TAPE AND DIE ATTACH ADHESIVE WITH PATTERNED BACKING |
摘要 |
<p>Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.</p> |
申请公布号 |
KR20100122110(A) |
申请公布日期 |
2010.11.19 |
申请号 |
KR20107021970 |
申请日期 |
2009.03.04 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
PLAUT DAVID J.;LARSON ERIC G.;GETSCHEL JOEL A.;BENSON OLESTER JR. |
分类号 |
C09J7/02;C09J133/08;C09J163/00;H01L21/58 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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