| 摘要 |
PROBLEM TO BE SOLVED: To cut a workpiece while enhancing the quality of a cut-off surface by suppressing vibration generated in a wire and guide rollers. SOLUTION: A wire sawing device 1 includes the wire 2; the guide rollers 3A to 3C; a frame 4, a motor 6; a workpiece feed portion 5; sensors 7A and 7B; and a controller 8. The wire 2 is stretched among these guide rollers 3A to 3C. The frame 4 rotatably holds these guide rollers 3A to 3C. The motor 6 allows the wire 2 to travel at a set speed. The workpiece feed portion 5 feeds the workpiece 50 toward the side of the wire 2 from a direction vertical to the side surface of the wire 2. These sensors 7A and 7B output detected instantaneous values related to positions of the guide rollers 3B and 3C. The controller 8 analyzes the detected instantaneous values inputted from these sensors 7A and 7B, and detects amplitude central values of vibration generated in these detected instantaneous values, and sets a speed at which the wire 2 travels so as to reduce their amplitude central values. COPYRIGHT: (C)2011,JPO&INPIT |
