| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a highly reliable wiring board of high density wiring, which includes a wiring conductor where a via hole and a groove, which are installed in an insulating layer, are filed with plated metallic layers with a simple structure and a simple method. <P>SOLUTION: An upper insulating layer 3 formed of an insulating layer of one layer is laminated on a lower insulating layer 1 where a lower wiring conductor 2 is formed. The via hole 4 where the wiring conductor 2 is set to be a base is formed in the insulating layer 3 by laser beam machining. The groove 6 for forming upper wiring conductor is formed on the surface of the insulating layer 3 by laser beam machining or wet blasting. The plated metallic layer 7 is bonded onto the insulating layer 3 so that the via hole 4 and the groove 6 may be filled with the layer 7. The plated metallic layer 7 is removed from the insulating layer 3 so that the plated metallic layer may be left in the via hole 4 and the groove 6 as it is while they are filled with the layer 7. The upper wiring conductor 8 formed of the plated metallic layer is formed in the via hole 4 and the groove 6. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
