发明名称 DEVICE AND METHOD FOR CHECKING PLATING, PROGRAM, AND COMPUTER-READABLE RECORDING MEDIUM
摘要 PROBLEM TO BE SOLVED: To greatly reduce the occurrence of defective substrates by allowing a plating check process of detecting a part that may cause a plating defect to be automatically executed by checking whether a plating process is normally applied, in a stage of manufacturing design of an electronic substrate. SOLUTION: A device for checking plating that is used in manufacturing design of an electronic substrate includes: a decision means for determining whether a plating process is applied in a predetermined condition to a part in the electronic board to which the plating process is to be applied; and a detection means for detecting a part to which the plating process is not applied in the predetermined condition and which causes a plating defect based on the decision results of the decision means. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010263170(A) 申请公布日期 2010.11.18
申请号 JP20090114948 申请日期 2009.05.11
申请人 ZUKEN INC 发明人 YAMAMOTO KOJI;WATANABE YASUYUKI
分类号 H05K3/00;G06F17/50 主分类号 H05K3/00
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