发明名称 |
DEVICE AND METHOD FOR CHECKING PLATING, PROGRAM, AND COMPUTER-READABLE RECORDING MEDIUM |
摘要 |
PROBLEM TO BE SOLVED: To greatly reduce the occurrence of defective substrates by allowing a plating check process of detecting a part that may cause a plating defect to be automatically executed by checking whether a plating process is normally applied, in a stage of manufacturing design of an electronic substrate. SOLUTION: A device for checking plating that is used in manufacturing design of an electronic substrate includes: a decision means for determining whether a plating process is applied in a predetermined condition to a part in the electronic board to which the plating process is to be applied; and a detection means for detecting a part to which the plating process is not applied in the predetermined condition and which causes a plating defect based on the decision results of the decision means. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2010263170(A) |
申请公布日期 |
2010.11.18 |
申请号 |
JP20090114948 |
申请日期 |
2009.05.11 |
申请人 |
ZUKEN INC |
发明人 |
YAMAMOTO KOJI;WATANABE YASUYUKI |
分类号 |
H05K3/00;G06F17/50 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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