| 摘要 |
An impedance matched circuit board utilizes a series of vias, one signal via that is surrounded by four ground vias in order to effect impedance matching with a coaxial signal transmission line. The vias are plated and extend through the thickness of the circuit board. Both opposing surfaces of the circuit board are provided with a conductive ground layer and each such ground layer has an opening formed there that encompasses one or more of the vias. On the top surface the opening surrounds the signal and ground via and on the bottom surface the opening only partially surrounds the signal via and the opening includes a convex portion formed therein.
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