| 摘要 |
PROBLEM TO BE SOLVED: To provide a new manufacturing method which can achieve the improvement in the characteristics of titanium-copper. SOLUTION: In the method for manufacturing a copper alloy for use in electronic components, the alloy contains, by mass, 2.0 to 4.0% Ti and a total of 0 to 0.5% of one or more third elements selected from the group consisting of Mn, Fe, Mg, Co, Ni, Cr, V, Nb, Mo, Zr, Si, B and P, with the remainder comprising copper and unavoidable impurities. In the method for manufacturing the titanium-copper alloy, a last solution treatment is performed, thereafter a heat treatment to increase the conductivity by 0.5 to 8% IACS, then a cold-rolling and a finally aging are performed successively. COPYRIGHT: (C)2011,JPO&INPIT |
