| 摘要 |
A mounting assembly includes a circuit board, a chip socket mounted on a topside of the circuit board with a chip attached thereon, a heat sink positioned on a top surface of the chip, and a backplate attached to an underside of the circuit board. The heat sink includes a pair of securing legs at two corners of the heat sink, and a pair of securing members. Each securing leg defines a securing hole thereon. Each securing member includes a spring thereon positioned between the corresponding securing legs and the circuit board. The securing members are secured in the corresponding securing holes to secure the heat sink to the circuit board.
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