发明名称 Circuit board module and method of making the same
摘要 A circuit board module includes a circuit board and a heat-dissipating device. The circuit board includes a ceramic substrate, and a circuit pattern formed on a surface of the ceramic substrate. The circuit board is sinter-bonded to a main body of the heat-dissipating device. A method of making the circuit board module is also disclosed.
申请公布号 US2010288537(A1) 申请公布日期 2010.11.18
申请号 US20100800414 申请日期 2010.05.13
申请人 HIGH CONDUCTION SCIENTIFIC CO., LTD. 发明人 CHIANG WEN-CHUNG;WU KENG-CHUNG;HSIEH YING-CHI;LU CHENG-KANG;FU MING-HUANG
分类号 H05K7/20;B23P15/26;H05K13/04 主分类号 H05K7/20
代理机构 代理人
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