发明名称 |
Circuit board module and method of making the same |
摘要 |
A circuit board module includes a circuit board and a heat-dissipating device. The circuit board includes a ceramic substrate, and a circuit pattern formed on a surface of the ceramic substrate. The circuit board is sinter-bonded to a main body of the heat-dissipating device. A method of making the circuit board module is also disclosed. |
申请公布号 |
US2010288537(A1) |
申请公布日期 |
2010.11.18 |
申请号 |
US20100800414 |
申请日期 |
2010.05.13 |
申请人 |
HIGH CONDUCTION SCIENTIFIC CO., LTD. |
发明人 |
CHIANG WEN-CHUNG;WU KENG-CHUNG;HSIEH YING-CHI;LU CHENG-KANG;FU MING-HUANG |
分类号 |
H05K7/20;B23P15/26;H05K13/04 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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