发明名称 EPITAXIAL GROWTH DEVICE AND METHOD FOR MANUFACTURING SILICON EPITAXIAL WAFER
摘要 PROBLEM TO BE SOLVED: To provide an epitaxial growth device for suppressing reverse flow of a gas and improving the uniformity of film thickness distribution of an epitaxial film formed on the surface of a wafer. SOLUTION: The epitaxial growth device 1 includes: a chamber 10 equipped with a gas flow path 2 in the inside and a susceptor 13 for holding the wafer W and provided in the gas flow path 2; and a plurality of gas supply holes 22 disposed on an upstream side of the gas flow path 2 and juxtaposed in a direction across the gas flow path 2. In the device, the position of the gas supply holes 22 which is a height direction of a normal line of the wafer W is set for each of the gas supply holes 22. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010263112(A) 申请公布日期 2010.11.18
申请号 JP20090113551 申请日期 2009.05.08
申请人 SUMCO CORP 发明人 HEBIKAWA YORIHIRO
分类号 H01L21/205;C23C16/455 主分类号 H01L21/205
代理机构 代理人
主权项
地址