发明名称 ADHESIVE RESIN COMPOSITION AND MOLDING
摘要 PROBLEM TO BE SOLVED: To provide an adhesive resin which is obtained by using a simple apparatus and an easy method and has excellent adhesiveness to a hard-to-stick base material and to provide a composition containing the adhesive resin. SOLUTION: An adhesive resin composition comprises (A) 1-99 parts weight epoxy group-containing modified polyolefin obtained by melt graft modification of a polyolefin resin with an epoxy group-containing vinyl monomer and (B) 99-1 parts weight acid-modified polyolefin obtained by melt graft modification of a polyolefin resin with α,β-unsaturated carboxylic acid or a monomer being the anhydride of the α,β-unsaturated carboxylic acid (provided that (A)+(B) is 100 parts weight). COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010260998(A) 申请公布日期 2010.11.18
申请号 JP20090114742 申请日期 2009.05.11
申请人 KANEKA CORP 发明人 OKADA YASUNORI;NISHIZA KENICHIRO
分类号 C09J151/06;C09J7/00;C09J123/26 主分类号 C09J151/06
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