RESIN WITH REDUCED FORMALDEHYDE EMISSION

摘要

The invention relates to resin compositions that may be used as binder for a wide variety of bonded structures including cellulosic materials such as particle board and plywood, veneer sheets, and non-woven materials such as mineral wool and glass fibers. The resin compositions include an amino component having 2-6 amino groups, an aldehyde, a trifunctional amino component and a crosslinking component for the trifunctional amino component, preferably a dialdehyde, by co-condensing of at least two of the said components. The resin compositions of the invention exhibit very low formaldehyde emissions when used in bonded structures in comparison to resin compositions of the prior art. The invention further relates to methods of making such resin compositions, methods of making bonded structures using such resin compositions, and bonded structures bound by such resin compositions.