PACKAGE ON PACKAGE TO PREVENT CIRCUIT PATTERN LIFT DEFECT AND METHOD OF FABRICATING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a package on package to prevent a circuit pattern lift defect, and a method of fabricating the same.

SOLUTION: The package on package includes a lower semiconductor package including a plurality of stacked semiconductor chips in it, a connection portion in a copper post form provided by removing part of a sealing material on an upper surface of the lower semiconductor package and having a height lower than that of the sealing material, and an upper semiconductor package connected to the connection portion of the lower semiconductor package via a solder ball in a fan-in structure. Consequently, the problem of the circuit pattern lift of a semiconductor chip at a top portion of the lower semiconductor package is solved to enhance reliability of solder joining between the upper and lower semiconductor packages.

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