| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a process for producing a circuit board that prevents the separation of solder bumps during the formation of the solder bumps and the formation of needle-like crystals and enables the steady production of a normal circuit board. <P>SOLUTION: The process for producing a circuit board includes the following steps of: applying an adhesiveness-imparting compound onto the surface of a terminal 2 arranged on a circuit board 1 to form an adhesive layer 5; attaching solder particles 11 onto the adhesive layer; applying an activating agent containing a hydrohalic acid salt of an organic acid base onto the solder particles and heating the circuit board on which the solder particles are attached at a temperature equal to or lower than the melting temperature of the solder to fix the solder particles; applying a flux onto the circuit board on which the solder particles are fixed; and heating the circuit board to melt the solder particles. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
