| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating material which can reduce insertion resistance and contact electric resistance, and to provide a method for producing the plating material. SOLUTION: In the plating material characterized in that the surface of a base material made of Cu or a Cu alloy is at least provided with a Cu-Sn alloy intermediate layer and an Sn surface layer in this order, the relation between the ten-point average roughness Rzμm as a parameter expressing the surface roughness of the Cu-Sn alloy intermediate layer and the maximum height Ryμm satisfies Ry/Rz<1.3, and also, the relation between the ten-point average roughness Rz and the average thickness tμm of the Sn surface layer satisfies Rz(6-π)/6≤t≤Rz(6-π)/6+0.3. COPYRIGHT: (C)2011,JPO&INPIT
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