发明名称 |
SOLID-STATE IMAGING DEVICE, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE |
摘要 |
A solid state imaging device that includes a semiconductor substrate having a plurality of photodiodes thereon and a first wiring portion, a second wiring portion and a third wiring portion, a first wiring layer over the semiconductor substrate and which includes a plurality of metal films and extends across all the wiring portions, and a second wiring layer over the first wiring layer and which extends across the first wiring portion and the second wiring portion.
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申请公布号 |
US2010288911(A1) |
申请公布日期 |
2010.11.18 |
申请号 |
US20100765432 |
申请日期 |
2010.04.22 |
申请人 |
SONY CORPORATION |
发明人 |
MIZUTA KYOHEI;ITONAGA KAZUICHIRO |
分类号 |
H01L27/146;H01L27/14;H01L31/12;H01L31/18;H04N5/335;H04N5/369;H04N5/372;H04N5/374 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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