发明名称 NONVOLATILE MEMORY ARRAY COMPRISING SILICON-BASED DIODES FABRICATED AT LOW TEMPERATURE
摘要 In embodiments of the invention, a method of forming a monolithic three-dimensional memory array is provided, the method including forming a first memory level that includes a plurality of memory cells, each memory cell comprising a plurality of conductors comprising aluminum or copper, and forming a silicon diode in each memory cell, wherein the silicon diode is formed at temperatures compatible with the conductors. The silicon diode may be formed using a hot wire chemical vapor deposition technique, for example. Other aspects are also described.
申请公布号 WO2010132346(A1) 申请公布日期 2010.11.18
申请号 WO2010US34210 申请日期 2010.05.10
申请人 SANDISK 3D, LLC;CLARK, MARK H.;HERNER, S. BRAD 发明人 CLARK, MARK H.;HERNER, S. BRAD
分类号 H01L27/102 主分类号 H01L27/102
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