发明名称 |
NONVOLATILE MEMORY ARRAY COMPRISING SILICON-BASED DIODES FABRICATED AT LOW TEMPERATURE |
摘要 |
In embodiments of the invention, a method of forming a monolithic three-dimensional memory array is provided, the method including forming a first memory level that includes a plurality of memory cells, each memory cell comprising a plurality of conductors comprising aluminum or copper, and forming a silicon diode in each memory cell, wherein the silicon diode is formed at temperatures compatible with the conductors. The silicon diode may be formed using a hot wire chemical vapor deposition technique, for example. Other aspects are also described. |
申请公布号 |
WO2010132346(A1) |
申请公布日期 |
2010.11.18 |
申请号 |
WO2010US34210 |
申请日期 |
2010.05.10 |
申请人 |
SANDISK 3D, LLC;CLARK, MARK H.;HERNER, S. BRAD |
发明人 |
CLARK, MARK H.;HERNER, S. BRAD |
分类号 |
H01L27/102 |
主分类号 |
H01L27/102 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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