发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADS AND TRANSPOSER AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: conductively bonding a first surface of a transposer to an inner end of a lead separate from the transposer; conductively bonding a die to the first surface of the transposer; and encapsulating the inner end with a mold compound having a bottom mold surface that is exposed and is coplanar with a surface of the transposer opposite the first surface. |
申请公布号 |
US2010289128(A1) |
申请公布日期 |
2010.11.18 |
申请号 |
US20090467146 |
申请日期 |
2009.05.15 |
申请人 |
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发明人 |
CAMACHO ZIGMUND RAMIREZ;BATHAN HENRY DESCALZO;TRASPORTO ARNEL SENOSA |
分类号 |
H01L23/52;H01L21/98 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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