| 摘要 |
<p>Heat-hardenable epoxide resin composition (I) comprises at least an epoxide-liquid resin (A1) with an average of one epoxide group per molecule; at least an epoxide-solid resin (A2) with an average of one epoxide group per molecule; at least a polymer impact modifier (D); at least a homopolymer (HP) of an olefinically unsaturated monomer (M), which is solid at room temperature; and at least a hardener (B) for epoxide resin, which is activated at high temperature; where the weight portion of D is less than 20 wt.%, and the weight quantity of (HP) is larger than the weight quantity of (D). Independent claims are included for: (1) a reinforcing element for reinforcing metal structures comprising a carrier on which (I) is applied; (2) adhering heat stable substrates comprising applying (I) on the surface of a heat stable substrate (S1), preferably a metal, contacting the applied surface with another surface of a heat stable substrate (S2), preferably a metal, and heating (I) at 100-200[deg] C, preferably 160-190[deg] C; (3) a structural foam obtained by heating (I); and (4) hardened epoxide resin composition obtained by heating (I) at 100-200, preferably 120-200[deg] C.</p> |
