FORMING METHOD OF WIRING PATTERN

摘要

PROBLEM TO BE SOLVED: To suppress and prevent a filling defect of a photosensitive wiring paste layer to a recess of an imprint mold and occurrence of collapse and peeling of a wiring pattern in the wet etching (phenomenon) process and to efficiently form the highly precise wiring pattern. SOLUTION: A forming method of the wiring pattern includes the process for forming the photosensitive wiring paste layer 2, the process for depressing the imprint mold 3 having an uneven pattern 17 to the photosensitive wiring paste layer 2 and the process for removing a non-photosensitive part of the photosensitive wiring paste layer 2 by wet etching and forming the wiring pattern corresponding to the uneven pattern of the imprint mold. Thickness tp of the photosensitive wiring paste layer 2 is regulated in a range of a following formula (1). Formula (1) 6μm+(V/S)