发明名称 |
BACKSIDE ILLUMINATED IMAGING DEVICE, SEMICONDUCTOR SUBSTRATE, IMAGING APPARATUS AND METHOD FOR MANUFACTURING BACKSIDE ILLUMINATED IMAGING DEVICE |
摘要 |
A backside illuminated imaging device performs imaging by illuminating light from a back side of a p substrate to generate electric charges in the substrate based on the light and reading out the electric charges from a front side of the substrate. The device includes n layers located in the substrate and on an identical plane near a front side surface of the substrate and accumulating the electric charges; n+ layers between the respective n layers and the front side of the substrate, the n+ layers having an exposed surface exposed on the front side surface of the substrate and functioning as overflow drains for discharging unnecessary electric charges accumulated in the n layers; p+ layers between the respective n+ layers and the n layers and functioning as overflow barriers of the overflow drains; and an electrode connected to the exposed surface of each of the n+ layers.
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申请公布号 |
US2010291730(A1) |
申请公布日期 |
2010.11.18 |
申请号 |
US20100821704 |
申请日期 |
2010.06.23 |
申请人 |
UYA SHINJI;NAGASE MASANORI;NAKAHASHI YOSUKE;HACHIYA TORU |
发明人 |
UYA SHINJI;NAGASE MASANORI;NAKAHASHI YOSUKE;HACHIYA TORU |
分类号 |
H01L31/18 |
主分类号 |
H01L31/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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