| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a dicing tape with a die attach film capable of smoothly picking up a semiconductor chip with high success rate without damaging the semiconductor chip even when it is extremely thin such as a thickness of 50μm or less, not degrading the mounting efficiency in die attach, and manufacturing a semiconductor apparatus with high productivity. <P>SOLUTION: A dicing tape with a die attach film is used for dicing of a semiconductor wafer, and includes a layer structure of a dicing tape/a supporting tape/a die attach film. The supporting tape includes a self-rolling peelability. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
