| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component and a piezoelectric vibrator which reliably connects a lead-out electrode and a through electrode. SOLUTION: The piezoelectric vibrator 10 is formed by mounting a piezoelectric vibration chip 14 having excitation electrodes (first and second excitation electrodes 26, 28) on a base substrate 42. The base substrate 42 includes through holes (first and second through holes 44, 46) formed on positions facing the piezoelectric vibration chip 14 and through electrodes (first and second through electrodes 52, 54) for sealing the through holes 44, 46. The piezoelectric vibration chip 14 includes projections (first and second projections 36, 38) and conductive films (first and second metal films 48a, 50a, etc.) formed on the surfaces of the projections 36, 38 and electrically connected to the excitation electrodes 26, 28 on the main surface of the piezoelectric vibration chip 14, which faces the through holes 44, 46, and is configured so that the conductive films formed on the surfaces of the projections 36, 38 penetrate through the aperture surfaces of the through holes 44, 46, which face the piezoelectric vibration chip 14. COPYRIGHT: (C)2011,JPO&INPIT |
