摘要 |
PROBLEM TO BE SOLVED: To provide a heat-conducting structure of a printed board capable of securing sufficient heat conduction capacity between both surfaces of the board by a simple method, and securing a uniform metal plated layer on the front surface of the board. SOLUTION: This heat-conducting structure of a printed board includes conductor layers 2 formed of metal foil and formed on both surfaces of an insulation board material 1, and a heat-conducting member 3 filled in a through-hole H formed on the insulation board material 1 along with the conductor layers 2 on both the surfaces, and is composed by forming metal plated layers 4 on the surfaces of the heat-conducting member 3 and the conductor layers 2, wherein the heat-conducting member 3 is composed by fitting and arranging, in the through-hole H, a columnar member formed at a length L projecting from the through-hole H, and plastic deformation parts 3a extending to the inside surfaces of the conductor layers 2 in openings at both the ends of the through-hole H are formed by a press working in its axial direction. COPYRIGHT: (C)2011,JPO&INPIT
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