发明名称 |
HEAT DISSIPATION STRUCTURE FOR COMMUNICATION CHASSIS |
摘要 |
A heat dissipation structure for communication chassis. The heat dissipation structure includes an enclosure. At least one first copper heat absorption component and at least one first heat pipe assembly are disposed in the enclosure. The first heat pipe assembly is connected with the first copper heat absorption component and a section not in contact with the first copper heat absorption component. The first heat pipe assembly serves to quickly transfer heat absorbed by the first copper heat absorption component to the section not in contact with the first copper heat absorption component to dissipate the heat.
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申请公布号 |
US2010290189(A1) |
申请公布日期 |
2010.11.18 |
申请号 |
US20090464287 |
申请日期 |
2009.05.12 |
申请人 |
HUANG CHIU-MAO;HUANG CHANG-MOU |
发明人 |
HUANG CHIU-MAO;HUANG CHANG-MOU |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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