摘要 |
<p>A surface micromachining process for manufacturing Electro-acoustic transducers, particularly ultrasonic transducers, the transducers comprising a silicon semiconductor substrate ( 1 ), on an upper surface of which one or more membranes ( 18 ) of resilient materials are supported by a structural layer ( 11 ) of insulating material, rigidly connected to the semiconductor substrate ( 1 ), the resilient material having a Young's modulus not lower than 50 GPa, the membranes ( 18 ) being metallised, the transducers including one or more lower electrodes ( 23, 25 ), rigidly connected to the semiconductor substrate. The process is characterised in that the structural layer ( 11 ) includes silicon monoxide. The invention further relates to an Electro-acoustic transducer, particularly an ultrasonic transducer, characterised in that the insulating material of the structural layer ( 11 ) is silicon monoxide. The invention also relates to an intermediate product for utilisation in the process for realising Electro-acoustic transducers, particularly ultrasonic transducers.</p> |
申请人 |
CONSIGLIO NAZIONALE DELLE RICERCHE;ESAOTE S.P.A.;UNIVERSITA' DEGLI STUDI ' ROMA TRE' |
发明人 |
FOGLIETTI, V.;CIANCI, E.;MEMMI, D.;CALIANO, G.;PAPPALARDO, M. |