PACKAGE ON PACKAGE PREVENTING CIRCUIT PATTERN LIFT DEFECT AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A package on package preventing circuit pattern lift defect and a method for fabricating the same are provided to prevent the cleavage defect of a circuit pattern caused by the stress of temperature variation by implementing a role of a buffer layer which absorbs the stress by the temperature variation. CONSTITUTION: A package manufacturing substrate(110) is prepared. A plurality of semiconductor chips(116) is laminated on the substrate. A pad redistribution pattern(118) is formed on the laminated top part of semiconductor chip. A copper post(120) is formed on a connection terminal of the pad redistribution pattern.