| 发明名称 |
Heat sink mounting method |
| 摘要 |
The present invention provides a method/device for mounting a heat sink on a Ball Grid Array (BGA) chip further on a Printed Circuit Board (PCB). In detail, the method uses glue at the corners and the periphery of the bottom of the heat sink to fasten the heat sink to the PCB. |
| 申请公布号 |
EP2251903(A1) |
申请公布日期 |
2010.11.17 |
| 申请号 |
EP20090305435 |
申请日期 |
2009.05.14 |
| 申请人 |
THOMSON LICENSING, INC. |
发明人 |
KIEW, KIAN CHOY;SHI, JI WEI;HUANG, WEN XIN |
| 分类号 |
H01L23/40 |
主分类号 |
H01L23/40 |
| 代理机构 |
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代理人 |
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| 主权项 |
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