SURFACE TREATING AGENT FOR TIN OR TIN ALLOY MATERIAL

摘要

There is disclosed is a method comprising surface-processing a Sn based, Sn alloy based or Sn-Zn alloy based solder particle (1), applied as a coating, such as by electrical plating or melt plating, to the surface of a metal material, such as iron, a steel plate or copper, with a phosphate and a silicium containing compound, to form a protective film (2). There are also disclosed a solder material (6) in which a protective film (2) formed of a phosphate and a silicium containing compound is formed on the surface of the Sn-Zn based solder particle (1), and a solder paste formed of this solder material (6) and the flux.