发明名称 SOLDERING INSPECTION SYSTEM
摘要 PURPOSE: A solder inspection system is provided to reduce test time by simultaneously collecting the image of the test region of a PCB assembly by using a plurality of image collecting devices. CONSTITUTION: A plurality of electronic parts(112a-112c) are arranged on a PCB(111). A solder part(113a-113c) welds the electronic parts to the printed circuit board. The electronic part is welded to the printed circuit board through the through hole technology. A lead(L1-L3) is electrically connected to the printed circuit board with the printed circuit. A plurality of image collecting parts(121,122) transmits the image of light reflected from a PCB assembly(110) to a determination part(130).
申请公布号 KR20100120909(A) 申请公布日期 2010.11.17
申请号 KR20090039775 申请日期 2009.05.07
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, NO JUNG;OH, CHAN SEOB;HAN, KYO SHIK;KIM, DO WAN;KIM, JEONG SOO;KIM, MYEONG MUK;KWON, KEUN HYEOG
分类号 H01L21/60;G01B11/24;H05K13/08 主分类号 H01L21/60
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